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Part Number Complete

SH-HTPCS-[50-200/1]-[50-200/1]-[15-30/5]-R[1,2]-N[1,2,3,4,5,6,7]-P[25-175/1]

Cleaning Method Thread Diameter Selection [R] 1 (1/8) 2 (1/4) Number of Cooler Holes [N] Pitch [P] A B T type Days to Ship

Specification/Dimensions

Cleaning Method
- Degreasing
- Precision Cleaning
Clear
Thread Diameter Selection [R] 1 (1/8) 2 (1/4)
1

2
Clear
Number of Cooler Holes [N]
1

2

3

4

5

6

7
Clear
Pitch [P](mm)
[25-175/1mm Unit(s)]
Clear
A(mm)
[50-200/1mm Unit(s)]
Clear
B(mm)
[50-200/1mm Unit(s)]
Clear
T(mm)
[15-30/5mm Unit(s)]
Clear
type
- SH-HTPCS
- SL-HTPCS
Clear

Days to Ship

All

14 Day(s) or Less
Clear

Specify Alterations

[Clean & Pack]Cooling Plates (Part Number)

Name: [Clean & Pack]Cooling Plates
Brand: MISUMI
Availability: PreOrder

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MISUMI

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Price :

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(i)
Caution

See here for related information such as technical information on cleaning effects and other cleaned product lineups.
Cleaning also removes rust prevention oil, which may make the product more susceptible to rusting than an uncleaned product.
Please be careful about the application location and storage environment.

Product Description

Three types of cleaning methods are available: degreasing, precision cleaning, and electrolytic polishing + precision cleaning. They can be ordered from one piece with the standard part number.
This eliminates the need for customer cleaning or outsourced cleaning, reducing the amount of time and effort required.

■ Part Number for Clean & Pack Products

· Degreasing (Anti-rust single packing)	: Part Number SL-□□
· Precision cleaning (Degassing double packing)	: Part Number SH-□□
· Electrolytic polishing + Precision cleaning (Degassing double packing)	: Part Number SHD-□□

Product Part Number	Cleaning Method	Packaging Type	Effects Compared to Uncleaned Product	Environment (Standard)	Process
SL-□□	Degreasing	Anti-rust packing	Oil removal	General environment	Regular assembly process
					Post battery assembly process
SH-□□	Precision cleaning	Degassing double packing	Oil removal Dust removal	Clean environment (Class 10 to 1,000)	Battery assembly process
					LCD-related post assembly process
					In-vehicle camera assembly process
SHD-□□	Electrolytic polishing + Precision cleaning	Degassing double packing	Oil removal Dust removal Outgas reduction	Vacuum environment Clean environment (Class 10 to 1,000)	Pre-semiconductor process
					Liquid crystal deposition process
					Pre-OLED process

■ Notes
Cleaning also removes rust prevention oil, which may make the product more susceptible to rusting than an uncleaned product.
Please be careful about the application location and storage environment.

By passing cooling water through the plate, the heated object can be effectively cooled down.

Type	Material	[M] Material	Cleaning Method
Type	Surface Treatment Code	[M] Material	Cleaning Method	Cleaning Environment	Packaging Type	Packing Environment
SL-HTPC	S	SUS303	Degreasing	General environment	Anti-rust packing	General environment
SH-HTPC	S	SUS303	Precision cleaning	Class 1,000	Degassing double packing	Class 10

[ ! ] Products are packed by order quantity. If the order is for 20 pieces, they are packed in one package (incl. 20 pieces).
[ ! ] See the

details of degreasing, precision cleaning, and electrolytic polishing shown at the bottom of the specification table.

Specification Table

Part Number		Plate						RC (PT)	—	N (Number of Cooler Holes)	—	P (Pitch)
	—						—
		A	—	B	—	T
SL-HTPCS	—	100	—	100	—	20	—	R1	—	N4	—	P25
SH-HTPCS	—	200	—	200	—	15	—	R1	—	N4	—	P30

M₁ Size Table
(d) Size Table

A	B	M₁
50 to 100	50 to 100	M4 × 0.7 Depth 6
50 to 100	101 to 200	M5 × 0.8 Depth 8
101 to 200	50 to 100	M5 × 0.8 Depth 8
101 to 200	101 to 200	M6 × 1.0 Depth 10

Rc (PT)	(d)
1 (1/8)	8.5
2 (1/4)	11.4

Part Number		1 mm Increments		T	Rc (PT)	N	P
Type	Material Code	A	B	5 mm Increments		Number of Cooler Holes	1 mm Increments
SL-HTPC	S	50 to 200	50 to 200	15 to 30	1 (1/8)	1 to 7	25 or more(A−25)
SH-HTPC				20 to 30	2 (1/4)

[ ! ] The distance from the upper, lower or side plate end faces to the cooler holes and tapped hole should be 2 mm or more.
[ ! ] The distance between all holes (between cooler holes, or between cooler holes and tapped holes) should be 2 mm or more.

Cleaning Process
· Degreasing (Part Number: SL-□□)

Working Environment: General environment
Alkaline warm pure water		Ultrasonic pure water cleaning after cleaning with pure water *3 times		Dry		Anti-rust single packing

· Precision cleaning (Part Number: SH-□□)

				Working Environment: Class 1,000				Working Environment: Class 10
Hydrocarbon cleaning Ro water cleaning		Wash with pure water (10 MΩ·cm) after high-pressure water jet cleaning (Ro water)		Use pure water (13 MΩ·cm)		Use nitrogen blow		Conducted on a clean bench in a Class 10 clean environment

· Electrolytic polishing + precision cleaning (Part Number: SHD-□□)

						Working Environment: Class 1,000				Working Environment: Class 10
Hydrocarbon cleaning Ro water cleaning		Electrolytic polishing with an electrolytic polishing layer according to the material		Wash with pure water (10 MΩ·cm) after high-pressure water jet cleaning (Ro water)		Use warm pure water (13 MΩ·cm)		Use nitrogen blow		Conducted on a clean bench in a Class 10 clean environment

Packaging Example

For degreasing:
(Part Number: SL-□□)

For precision cleaning or electrolytic polishing + precision cleaning:
(Part Number: SH-□□/SHD-□□)

[ ! ] Both the first and second layer packaging are degassed.

Cleaning Effectiveness / Recommended Environment for Use

Cleaning Method	Product Part Number	Packaging Type	Effects Compared to Uncleaned Product	Environment (Standard)	Use Case and Process
Degreasing	SL-□□	Anti-rust packing	Oil removal	General environment	Regular assembly process
Degreasing	SL-□□	Anti-rust packing	Oil removal	General environment	Post battery assembly process
Precision cleaning	SH-□□	Degassing double packing	Oil removal Dust removal	Clean environment (Class 10 to 1,000)	Battery assembly process
					LCD-related post assembly process
					In-vehicle camera assembly process
Electrolytic polishing + Precision cleaning	SHD-□□	Degassing double packing	Oil removal Dust removal Outgas reduction	Vacuum environment Clean environment (Class 10 to 1,000)	Pre-semiconductor process
					Liquid crystal deposition process
					Pre-OLED process

: 30; 60; 90

Part Number
SH-HTPCS-[50-200/1]-[50-200/1]-[15-30/5]-R[1,2]-N[1,2,3,4,5,6,7]-P[25-175/1]
SL-HTPCS-[50-200/1]-[50-200/1]-[15-30/5]-R[1,2]-N[1,2,3,4,5,6,7]-P[25-175/1]

Part Number	Price	Minimum Order Qty.	Volume Discount	Days to Ship	Cleaning Method	Thread Diameter Selection [R] 1 (1/8) 2 (1/4)	Number of Cooler Holes [N]	Pitch [P] (mm)	A (mm)	B (mm)	T (mm)
	-	1 Piece(s)		14 Day(s) or more	Precision Cleaning	1 ～ 2	1 ～ 7	25 ～ 175	50 ～ 200	50 ～ 200	15 ～ 30
	-	1 Piece(s)		14 Day(s) or more	Degreasing	1 ～ 2	1 ～ 7	25 ～ 175	50 ～ 200	50 ～ 200	15 ～ 30

■ Accuracy Standards

● Thickness Parallelism

0.015 or less per 100 mm

● Flatness

T	10 to 15	16 to 25	26 or More
Per 100 mm	0.03	0.015	0.012

● Dimensional tolerance of A and B

99 mm or Less	100 to 200
±0.2	±0.3

● T Dimension Tolerance

±0.1

● Circumference Chamfering

C0.2 to C1.0

Basic Information

Environmentally friendly	RoHS Compliant (10 Substances)	Characteristics/Applications	Clean Washed	Body Material	SUS303
Plate Type	Cooling Plates

The specifications and dimensions of some parts may not be fully covered. For exact details, refer to manufacturer catalogs .

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