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SL-HTPCS-[50-200/1]-[50-200/1]-[15-30/5]-R[1,2]-N[1,2,3,4,5,6,7]-P[25-175/1]
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Specification/Dimensions

  • Thread Diameter Selection [R] 1 (1/8) 2 (1/4)

    • 1
    • 2

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  • Number of Cooler Holes [N]

    • 1
    • 2
    • 3
    • 4
    • 5
    • 6
    • 7

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  • Pitch [P](mm)

     [25-175/1mm Unit(s)]

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  • A(mm)

     [50-200/1mm Unit(s)]

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  • B(mm)

     [50-200/1mm Unit(s)]

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  • T(mm)

     [15-30/5mm Unit(s)]

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  • type

    • SH-HTPCS
    • SL-HTPCS

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  • Cleaning Method

    • Degreasing
    • Precision Cleaning

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Days to Ship

    • All
    • 14 Day(s) or Less

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[Clean & Pack]Cooling Plates

[Clean & Pack]Cooling Plates

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Brand :

MISUMI

MISUMI

Part Number :
SL-HTPCS-[50-200/1]-[50-200/1]-[15-30/5]-R[1,2]-N[1,2,3,4,5,6,7]-P[25-175/1]
SL-HTPCS-[50-200/1]-[50-200/1]-[15-30/5]-R[1,2]-N[1,2,3,4,5,6,7]-P[25-175/1]

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Caution

  • See here for related information such as technical information on cleaning effects and other cleaned product lineups.
  • Cleaning also removes rust prevention oil, which may make the product more susceptible to rusting than an uncleaned product.
    Please be careful about the application location and storage environment.

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Product Description

Three types of cleaning methods are available: degreasing, precision cleaning, and electrolytic polishing + precision cleaning. They can be ordered from one piece with the standard part number.
This eliminates the need for customer cleaning or outsourced cleaning, reducing the amount of time and effort required.
■ Part Number for Clean & Pack Products
· Degreasing (Anti-rust single packing)　　　　 : Part Number SL-□□
· Precision cleaning (Degassing double packing)　　　　 : Part Number SH-□□
· Electrolytic polishing + Precision cleaning (Degassing double packing) : Part Number SHD-□□
Product Part Number Cleaning Method Packaging Type Effects Compared to Uncleaned Product Environment (Standard) Process
SL-□□ Degreasing Anti-rust packing Oil removal General environment Regular assembly process
Post battery assembly process
SH-□□ Precision cleaning Degassing double packing Oil removal
Dust removal		 Clean environment (Class 10 to 1,000) Battery assembly process
LCD-related post assembly process
In-vehicle camera assembly process
SHD-□□ Electrolytic polishing + Precision cleaning Degassing double packing Oil removal
Dust removal
Outgas reduction		 Vacuum environment
Clean environment (Class 10 to 1,000)		 Pre-semiconductor process
Liquid crystal deposition process
Pre-OLED process
■ Notes
Cleaning also removes rust prevention oil, which may make the product more susceptible to rusting than an uncleaned product.
Please be careful about the application location and storage environment.

By passing cooling water through the plate, the heated object can be effectively cooled down.

TypeMaterial[M] MaterialCleaning Method
Surface Treatment CodeCleaning MethodCleaning EnvironmentPackaging TypePacking Environment
SL-HTPCSSUS303DegreasingGeneral environmentAnti-rust packingGeneral environment
SH-HTPCPrecision cleaningClass 1,000Degassing double packingClass 10
[ ! ] Products are packed by order quantity. If the order is for 20 pieces, they are packed in one package (incl. 20 pieces).
[ ! ] See the details of degreasing, precision cleaning, and electrolytic polishing shown at the bottom of the specification table.

Specification Table

Part Number Plate RC (PT)—N
(Number of Cooler Holes)		—P
(Pitch)
—     —
 A—B—T 
SL-HTPCS—100—100—20—R1—N4—P25
SH-HTPCS—200—200—15—R1—N4—P30
M1 Size Table
(d) Size Table
ABM1
50 to 10050 to 100M4 × 0.7 Depth 6
101 to 200M5 × 0.8 Depth 8
101 to 20050 to 100
101 to 200M6 × 1.0 Depth 10
 
Rc (PT)(d)
1 (1/8)8.5
2 (1/4)11.4
Part Number1 mm IncrementsTRc (PT)NP
TypeMaterial CodeAB5 mm IncrementsNumber of Cooler Holes1 mm Increments
SL-HTPCS50 to 20050 to 20015 to 301 (1/8)1 to 725 or more(A−25)
SH-HTPC20 to 302 (1/4)
[ ! ] The distance from the upper, lower or side plate end faces to the cooler holes and tapped hole should be 2 mm or more.
[ ! ] The distance between all holes (between cooler holes, or between cooler holes and tapped holes) should be 2 mm or more.
Cleaning Process
· Degreasing (Part Number: SL-□□)

Working Environment: General environment


Alkaline warm pure water
 
 
Ultrasonic pure water cleaning
after cleaning with pure water
*3 times
Dry
 
 
Anti-rust single packing
 
 
· Precision cleaning (Part Number: SH-□□)
 

Working Environment: Class 1,000

 

Working Environment: Class 10


Hydrocarbon cleaning
Ro water cleaning
 
Wash with pure water (10 MΩ·cm)
after high-pressure water jet cleaning (Ro water)
Use pure water (13 MΩ·cm)
 
Use nitrogen blow

 
Conducted on a clean bench in a Class 10 clean environment
 
· Electrolytic polishing + precision cleaning (Part Number: SHD-□□)
 

Working Environment: Class 1,000

 

Working Environment: Class 10


Hydrocarbon cleaning
Ro water cleaning

 
 
Electrolytic polishing with an electrolytic polishing layer according to the material
 
Wash with pure water (10 MΩ·cm) after high-pressure water jet cleaning (Ro water)
 
Use warm pure water (13 MΩ·cm)

 
 
Use nitrogen blow


 
 
Conducted on a clean bench in a Class 10 clean environment
 
Packaging Example
For degreasing:
(Part Number: SL-□□)
For precision cleaning or electrolytic polishing + precision cleaning:
(Part Number: SH-□□/SHD-□□)

[ ! ] Both the first and second layer packaging are degassed.
Cleaning Effectiveness / Recommended Environment for Use

Cleaning Method

Product Part Number

Packaging Type

Effects Compared to Uncleaned Product

Environment (Standard)

Use Case and Process

DegreasingSL-□□Anti-rust packingOil removalGeneral environmentRegular assembly process
Post battery assembly process
Precision cleaningSH-□□Degassing double packingOil removal
Dust removal		Clean environment (Class 10 to 1,000)Battery assembly process
LCD-related post assembly process
In-vehicle camera assembly process
Electrolytic polishing + Precision cleaningSHD-□□Degassing double packingOil removal
Dust removal
Outgas reduction		Vacuum environment
Clean environment (Class 10 to 1,000)		Pre-semiconductor process
Liquid crystal deposition process
Pre-OLED process
30
45
60
  1. 1
Part Number
SL-HTPCS-[50-200/1]-[50-200/1]-[15-30/5]-R[1,​2]-N[1,​2,​3,​4,​5,​6,​7]-P[25-175/1]
Part NumberPriceMinimum Order Qty.Volume DiscountDays to ShipCleaning Method Thread Diameter Selection [R] 1 (1/8) 2 (1/4) Number of Cooler Holes [N] Pitch [P]
(mm) 		A
(mm) 		B
(mm) 		T
(mm)

-

1 Piece(s) 14 Day(s) or more Degreasing1 ～ 21 ～ 725 ～ 17550 ～ 20050 ～ 20015 ～ 30

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  1. 1
■ Accuracy Standards
● Thickness Parallelism0.015 or less per 100 mm
● Flatness
T10 to 1516 to 2526 or More
Per 100 mm0.030.0150.012
● Dimensional tolerance of A and B
99 mm or Less100 to 200
±0.2±0.3
● T Dimension Tolerance±0.1
● Circumference ChamferingC0.2 to C1.0

Basic Information

Environmentally friendly RoHS Compliant (10 Substances) Characteristics/Applications Clean Washed Body Material SUS303
Plate Type Cooling Plates

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