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[Features]
· For cutting and polishing.
· Offset type.
· It is possible to electrodeposit, cut and polish diamonds on the front and back of the board at the same time.
· For finish polishing.
[Applications]
· For cutting and grinding roof tile, marble, FRP, refractory brick, glass, granite, etc.
· Tool used: disc grinder.
Particle Size(#) | 60 | Outer Diameter(mm) | 100 | Thickness(mm) | 14 |
---|---|---|---|---|---|
Hole Diameter(mm) | 15 | Max. Rotational Speed(rpm) | 15000 | Trusco Code | 171-4457 |
Mass(g) | 91.8 | Features | For cutting and polishing. It is offset type. It is possible to electrodeposit, cut and polish diamonds on the front and back of the board at the same time. For final polishing. | Application | Polishing/cutting of roof tile, marble, FRP, refractory brick, glass, granite, etc. Tool used: Disc grinder. |
Please check the type/dimensions/specifications of the part UFO-2 in the Diamond Electroplating Wheel for Both Cutting and Polishing series.
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