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Product DetailSpecification/Dimensions
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Surface treatment
- Black Anodize Treatment
- Without Treatment
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Pin for circuit board mounting
- Available
- NA
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Tap
- Available
- NA
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H(mm)
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W(mm)
Days to Ship
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- All
- 5 Day(s) or Less
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Heat Sink for Pin Mounting Device, P Series, Aluminum Extrusion Type (11PB15L25)
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Similar Products
Product DetailProduct Description
For TO type mold package devices, for solder fixing
Basic Information
| Application | For pin mounted devices | Heat sink type | Aluminum Extrusion | L(mm) | 25 |
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- The specifications and dimensions of some parts may not be fully covered. For exact details, refer to manufacturer catalogs .
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