Product Description

Lead free solder. Its excellent wettability, solder-freeing performance, and reliability provide improved workability.

[Features]
· Solder paste.
· [Eco Solder paste].
· "Eco Solder" is an environmentally friendly lead free solder paste that, when compared to traditional solder pastes, helps resolve problems such as heat-resistance (due to a high melting point), supply stability, wettability, and preservation stability—a problem associated with lead free solder.
· [S70G series].
· Maintains the viscosity stability of the GRN364 series by preservation and squeezing, while also providing improved reliability and performance in terms of heat-resistance and flux spattering. Improves in all aspects; from product mounting to production.
· Drastically improves the ability to prevent incomplete BGA fusion, which has been difficult to solve.
· Types which can improve thermostability and maintain temperature are also available.
· [374FS series].
· Developed for joining large surface areas such as during semi-conductor module mounting. Displays excellent cleaning properties with various types of cleaning solution. Reduces the occurrence of voids which form on the underside of bare chips, etc.
· [TVA series].
· A lead-free solder paste developed for usage in 3D implementation such as POP.
· [DSR series].
· A lead free solder paste for dispensing. Combines characteristics, enabling use with a wide range of applications.
· As well as general reflow heating, it also supports other heating methods such as rapid heating (laser, hot air, etc.)
· [345F series].
· Features improved cleaning of residues with various types of cleaning solution. Boasts heat-resistance and viscosity stability while also inhibiting the formation of solder balls.