(!)NOTE : Windows 7 users won’t be able to use some latest features of eCatalog/WOS since Microsoft is ending support for Windows 7 on 14 Jan, 2020. Please upgrade your system for uninterrupted services.
Product DetailSpecification/Dimensions
-
Note
- With oxidation inhibitor (phosphorus)
-
Alloy composition
- Sn-3.0Ag
- Sn-3.0Ag-0.5Cu
-
Usage
- For additional supply
- For initial supply
Days to Ship
-
- All
- 15 Day(s) or Less
- 17 Day(s) or Less
- 24 Day(s) or Less
Specify Alterations
Eco Solder Solder Bar (M705)
Copy Part Number URL to Clipboard
The part number URL has been copied into your clipboard.
-
- Starting From :
- 12,351₹/Unit
-
- Order Qty :
-
-
- Total Price :
- ---
-
- Days to ship :
- ---
Select part number to Order Now/ Add to Cart
Similar Products
Product DetailProduct Description
A highly reliable solder bar.
[Features]
· Solder paste.
· [Eco Solder paste].
· "Eco Solder" is an environmentally friendly lead free solder paste that, when compared to traditional solder pastes, helps resolve problems such as heat-resistance (due to a high melting point), supply stability, wettability, and preservation stability—a problem associated with lead free solder.
· [S70G series].
· Maintains the viscosity stability of the GRN362 series by preservation and squeezing, while also providing improved reliability and performance in terms of heat-resistance and flux spattering. Improves in all aspects; from product mounting to production.
· Drastically improves the ability to prevent incomplete BGA fusion, which has been difficult to solve.
· Types which can improve the thermostability of ingredients and maintain temperature are also available.
· [374FS series].
· Developed for joining large surface areas such as during semi-conductor module mounting. Displays excellent cleaning properties with various types of cleaning solution. Reduces the occurrence of voids which form on the underside of bare chips, etc.
· [TVA series].
· A lead-free solder paste developed for usage in 3D implementation such as POP.
· [DSR series].
· A lead free solder paste for dispensing. Combines characteristics, enabling use with a wide range of applications.
· As well as general reflow heating, it also supports other heating methods such as rapid heating (laser, hot air, etc.)
· [345F series].
· Features improved cleaning of residues with various types of cleaning solution. Boasts heat-resistance and viscosity stability while also inhibiting the formation of solder balls.
Basic Information
| Supply form | Rod Shape | Amount of Content | 1 pack (with 1 kg) |
|---|
- The specifications and dimensions of some parts may not be fully covered. For exact details, refer to manufacturer catalogs .
Payment Method
- Credit Card
-
- Debit Cart
-
- Net Banking
-
- UPI
-
- Cheque on delivery
-
- Online payment
-
Social Media
MISUMI India Contact
Copyright © MISUMI Corporation All Rights Reserved.
How can we improve?
How can we improve?
Thank you for your time.
Your feedback is essential for our continuous improvement
Privacy Policy
Thank you for your cooperation.
Thank you for your time.
Your feedback is essential for our continuous improvement
Please use the inquiry form.
Privacy Policy