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1.25-mm Pitch Miniature Crimp Connector (UL Standard Certified Product), DF13 Series【1-10,000 Pieces Per Package】 (Part Number)

1.25-mm Pitch Miniature Crimp Connector (UL Standard Certified Product), DF13 Series
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Product Description

Connector for board-to-cable connection with 1.25-mm pitch. Choose from a number of variations from 2–40 pin, straight-mount, right-angle mount, DIP, and SMT.

[Features]
· Small.
· A low-profile design with a mounting height of 5.8 mm. (The SMT mounting is a straight type, the DIP type is a straight 5.3-mm, and the right-angle type is 3.6-mm.)
· Multipole
· The dual-row type is a multipole connector with up to 40 pins. It is a high-density connector with a surface area of 30% compared to the single-row type.
· Supports automatic mounting.
· The header is available with a suction surface that supports vacuum suction . Therefore, automatic mounting using embossed packing is possible.
· Complete basic functionality despite compact form factor.
· The header includes a box structure to prevent twisting and ensure incorrect insertion is completely prevented.
· Additionally, the Surface Mount (SMT) header is fitted with a reinforcement bracket to prevent solder from peeling.

In-stock made-to-order products cannot be returned or canceled. Thank you for your understanding.

Main Features of DF13 Series 1.25‑mm Pitch Board-to-Cable Connectors

Supports automatic mounting: Features an adsorption type surface for use with automatic mounting equipment

Supports automatic mounting: Features an adsorption type surface for use with automatic mounting equipment

TypeMounting MethodMounting Height (h)
Straight
type





DIP5.3 mm
SMT5.8 mm
Right
angle
type






DIP3.6 mm
SMT

Low-profile mounting height

Miniature size
Low-profile mounting height of 5.8 mm. (SMT mounting straight type) (DIP types are 5.3 mm on the straight and 3.6 mm at the right-angle.)
Multi-contact
The double-row type features up to 40 contacts and a mounting surface with a 30% higher density than single-row types.
Supports automatic mounting
Header grades are available that feature adsorption type surfaces for use in vacuum suction type mounting. Also supports automatic mounting using embossed packaging.
Compact, yet full of functions
The header features a box structure that prevents twisting and erroneous insertion. The surface mounted (SMT) header also includes a reinforced fitting to prevent solder peeling.
Compliant with UL standards
Supports use with glow wires (compliant with IEC 60695-2-11)

Product Standards

RatingRated CurrentStandard1 AOperating Temperature Range-35 to 85°C (Note 1)Storage temperature range-10 to 60°C (Note 2)
UL
Rated voltageStandard150 V ACOperating humidity range20 to 80% (Note 3)Storage humidity range40 to 70% (Note 2)
UL29.9 V DC/V AC
ItemStandardConditions
1. Insulation resistance500 MΩ or moreMeasure at 100 V DC.
2. Withstand voltageThere shall be no flashover or dielectric breakdown.Energize at 500 V AC for 1 min.
3. Contact resistance30 mΩ or lessMeasure at 100 mA
4. Single unit insertion/extraction forceMin: 0.3 N (30 gf), Max: 3 N (300 gf)Measure using a steel pin of □0.35 ±0.002 mm
5. Vibration resistanceThere shall be no discontinuity for 1 μs or greater.Frequency: 10 to 55 Hz, Single amplitude: 0.75 mm, Three directions, 2 hours
6. Humidity resistanceContact resistance: 30 mΩ or less, Insulation resistance: 500 MΩ or moreLeave at temperature 40°C ±2°C and humidity 90 to 95% for 96 hours
7. Temperature cycleContact resistance: 30 mΩ or less, Insulation resistance: 500 MΩ or more(-55°C: 30 mins > 5 to 35°C: 10 mins > 85°C: 30 mins > 5 to 35°C: 10 mins) 5 cycles
8. Durability (Mating / Un-mating)Contact resistance: 30 mΩ or lessTin-plated: 30 timesGold-plated: 50 times
9. Solder heat resistanceNo melting of resin parts affecting performance.DIP typeFlow: 250°C for 10 secondsManual solder: Soldering iron temperature of 300°C for 3 seconds
SMT typeReflow: Using the recommended temperature profileManual solder: Soldering iron temperature of 300°C for 3 seconds

(Note 1) This includes temperature increases caused by the flow of current.
(Note 2) The term "storage" refers to products stored for long periods of time prior to mounting and use. The operating temperature and humidity range are applicable in a non-energized state after board mounting.
(Note 3) Avoid condensation when using.

Product Materials/Processing

ProductPart NameMaterialsFinishUL Standard
Crimp socketInsulatorPolyamide resinBeigeUL94V-0
Crimp contacts for socketsContactsPhosphor bronzeTin plating or gold plating-
Pin header
(DIP)
InsulatorPolyamide resinBeigeUL94V-0
ContactsBrassTin plating-
Pin header
(SMT single-row)
InsulatorPolyamide resinBeigeUL94V-0
ContactsBrassTin plating or gold plating-
BracketPhosphor bronzeTin plating-
Pin header
(SMT double-row)
InsulatorPolyamide resinBeigeUL94V-0
ContactsBrassTin-copper plating or gold plating-
BracketPhosphor bronzeTin plating-

Product Specifications

Connector TypeContact, socket, header, other
HarnessNo, yes
Compliance StandardsJIS, IEC
Safety StandardsUL
Number of Contacts2, 10, 11, 12, 13, 14, 15, 20,
30, 3, 40, 4, 5, 6, 7, 8, 9
No. of Rows (Mating Part)1, 2
Mounting Pitch1.25 mm
Opening Pitch1.25 mm
Rated Current1 A
Rated Voltage (AC)150 V AC
Number of Matings and Un-Matings30, 50
Board Mounting MethodSMT, through-hole DIP
Opening DirectionStraight, right-angle
Board Mounting StyleStandard on-board
Contact PlatingGold, tin, tin-copper
Wiring MethodCrimp
Compatible Wire TypeDiscrete wire
Compatible Wire Size
(AWG) Min.
AWG 32, 30
Compatible Wire Size
(AWG) Max.
AWG 26, 30
Operating Temperature Range (Max.)85°C
Operating Temperature Range (Min.)-35°C
Glow Wire CompatibleYes

Product Usage Precautions

Recommended temperature profile (SMT)

Recommended temperature profile (SMT)

1. Recommended temperature profile (SMT)

[Applicable conditions]

  1. 1. Peak temperature: Max. 250°C
  2. 2. Heating area: 230°C or more for less than 60 seconds
  3. 3. Preheating area: 170 to 190°C for 60 to 120 seconds
  4. 4. Cycles: 2 or less

*Measurement conducted at contact lead part.
The temperature profile may vary due to external conditions such as the type of cream solder, manufacturer, and board size. Be sure to check all potential factors before use.
(Note 1) This temperature profile is a recommended value.
(Note 2) The same conditions can be applied twice. However, the temperature between the 1st and 2nd cycles should be returned to room temperature.
(Note 3) The temperature profile indicates the board surface temperature at the point of contact with the connector lead part.
(Note 4) Slight variations in color of the insulating case after reflow do not affect the form, fit or function of the connector.

2. Recommended manual soldering conditions (SMT)

Soldering iron temperature: 290 ±10°C, Soldering time: 2 seconds or less

3. Recommended screen thickness (SMT)

0.15 to 0.2 mm

4. Board warpage (SMT)

Max 0.03 mm in the connector center area, based on both connector edges

5. Recommended soldering conditions (DIP)

■ Flow conditions for automatic soldering equipment - Soldering temperature: 250°C ±5°C, Soldering time: 3 seconds or less
■ Manual soldering conditions: Soldering iron temperature: 290°C ±10°C, Soldering time: 2 seconds or less

6. Cleaning conditions

Supports IPA cleaning. (Cleaning is not recommended because cleaning may change the insertion/extraction feeling etc. Please inquire regarding the use of other cleaners.)

7. Wiring conditions

■ Because the crimped contacts are extremely small, crimping should be performed carefully while referring to the "Crimping Condition Sheet" and "Crimping Quality Standards".

8. Precautions

■ Be aware that twisting excessively during insertion and extraction may result in breakage.

Product Handling

Precautions for insertion (How to hold) Lightly grip the base of the cable and press the connector with your finger to insert. (Insertion angle) [Caution] Do not insert at an angle of 30° or more. Doing so may cause contact deformation or case breakage. (How to insert) Insert the connector horizontally.

Precautions for insertion
(How to hold)
Lightly grip the base of the cable and press the connector with your finger to insert.
(Insertion angle)
[Caution] Do not insert at an angle of 30° or more. Doing so may cause contact deformation or case breakage.
(How to insert) Insert the connector horizontally.

Precautions for removal (How to hold) Remove by holding the cable so that the entire cable is pulled out evenly. (Removal angle) [Caution] Do not remove at an angle of 30° or more. Doing so may cause contact deformation or case breakage. (How to remove) Remove the connector horizontally.

Precautions for removal
(How to hold)
Remove by holding the cable so that the entire cable is pulled out evenly.
(Removal angle)
[Caution] Do not remove at an angle of 30° or more. Doing so may cause contact deformation or case breakage.
(How to remove) Remove the connector horizontally.

Part Number
DF13C-8P-1.25V(21)
Part NumberPriceMinimum Order Qty.Volume DiscountDays to ShipApplicable pin/contact Number Of Pins Connector Type Wiring Method Connection direction Plating of part touching terminal Product Category Specifications Features Wire connection form Specification number

₹ 28.00

1,000 Piece(s) 35 Day(s) or more Male8For PCB[Other] Circuit Board Mounting (SMT)StraightTinSingle low pin headerEmbossing adhesion-compatible productNAStress SMT21

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Basic Information

Connector Shape Rectangular Connector series initials D/E/F D/E/F DF
Rated Current(A) 1 Allowable Voltage(V) AC150 Contact Pitch(mm) 1.25
Operating Temperature Range(°C) -35 to +85 Terminal pitch(mm) 1.25
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