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| Item | MISUMI existing products | MISUMI Economy Type | Market distribution product* |
| Subject matter | Brass | Phosphor bronze | Copper nickel alloy |
| Head surface treatment | Rhodium plating | Gold plating | Nickel plating |
| Service life | 300,000 times | 100,000 times | 50,000 to 80,000 times |
Slight wear occurs
Severe wear and tear
Misumi's rhodium-plated and gold-plated products show no significant change in load and resistance values even after 200,000 uses.
Misumi products have excellent electrical conductivity and very stable resistance values compared to nickel plating on the market due to gold plating.
| Durability test | Initial value | 10,000 times | 50,000 times | 100,000 times | 200,000 times |
| Rhodium Plating | 1,873 | 1,890 | 1,898 | 1,908 | 1.957 |
| Gold plating | 1,936 | 2.043 | 2.083 | 2.044 | 1.986 |
| Durability test | Initial value | 10,000 times | 50,000 times | 100,000 times | 200,000 times |
| Rhodium plating | 37.92 | 51.91 | 50.34 | 66.70 | 55.65 |
| Gold plating | 29.53 | 31.14 | 30.40 | 31.95 | 33.61 |
※ Market distribution products are similar products that we purchase at random from online and offline markets.
※ The experimental data is obtained through our own inspection measurements and is provided for reference only.
Test probes are widely used in the testing field of semiconductors (ICs) and printed circuit boards (PCBs), and the probes are mounted inside a socket or jig. The socket or jig is mounted between the object to be measured and the test board, and the probe is connected to the object to be measured and the test board, transmitting a constant current and frequency to determine whether the object to be measured passes or fails
Spring probes are used to test the performance of semiconductor ICs. The upper head of the probe contacts the IC measurement point (PAD, BALL, etc.) and the lower pin contacts the measurement board to transmit a constant current and frequency to determine whether the measurement object is qualified.
Printed circuit board (PCB) probes are generally assembled with bushes and used to test the continuity of circuit boards. They are also used to test actual boards (ICT/FCT) with components connected.